Welcome Remarks

李宗鴻 Mr. Brian Lee
策略長,穩懋半導體
CSO, Win Semiconductors Corp.

劉揚偉 Mr. Young Liu
董事長,鴻海科技集團
Chairman, Hon Hai Technology Group (Foxconn)

Moderator

林嘉孚 Dr. Barry Jia-Fu Lin
技術長,聯穎光電股份有限公司
CTO, Wavetek Microelectronics Corp.

Paths Toward a Greener Future: Decarbonization with Innovative Silicon and WBG Solutions

黃茂原 Mr. Gary Huang
台灣總經理,英飛凌
Managing Director of Taiwan, Infineon Technologies Taiwan Co. Ltd.

The Proliferation of GaN in Data Center & Automotive Applications

Mr.Stephen Coates
General Manager (Asia) & VP Operations,GaN Systems Inc.

Extending the Benefits of Gallium Nitride (GaN) Solutions from Power Delivery to Other Industrial Applications

李原榮 Mr. Luke Lee
President of Korea, Taiwan and South Asia, Texas Instruments

Break Time

The Next Challenges and Opportunity to Power GaN and RF GaN Technologies

邱顯欽 Dr. Hsien-Chin Chiu
資深處長, 技術開發五處, 聯華電子股份有限公司
Senior Director, United Microelectronics Corporation

Accelerating Reliability for Automotive ICs

周發業 Mr. Edwin Chew
Manager, Regional Product Marketing, KLA Corporation

A Strategy for Growth in Power and Opto-Electronics

Dr. Andy G Sellars
Strategic Development Director, CSA Catapult

Lunch Break

Opening Remarks

Moderator

程一誠 Dr. Yi-Cheng Cheng
所長,材料暨光電研究所,國家中山科學研究院
General Director, NCSIST

Compound Semiconductors: The Next Generation of Semiconductors

Mr. Americo Lemos
Chief Executive Officer, IQE

Compound Semiconductor Evolve the Lifestyle from the RF to Lightwave

黃智文 Dr. Chuck Huang
資深協理,行銷中心,穩懋半導體
Sr. AVP, Marketing Center,WIN Semiconductors Corp.

III V and Optics in Data Center Network Hardware

司馬學文 Ms. Claire Szu Ma
協理,雲端供應鏈採購與策略部,微軟
Manager of Network Sourcing, CSCP Dept., Microsoft

Monolithically Integrated GaN Chips

陳科宏 Dr. Ke-Horng Chen
講座教授,電機工程學系,國立陽明交通大學
Chair Professor, Department of Electronics and Electrical Engineering in NYCU

Break Time

High Throughput MOCVD Solution for GaN Based Compounds Semiconductors

Dr. Nicolas Muesgens
Senior Product Manager, Product Marketing Management, AIXTRON SE

Enhancing GaN HEMT Performance for Power Electronics Applications with Atomic Scale Processing Production Solutions

Mr. Klaas Wisniewski
Executive Director, Plasma Technology Oxford Instruments

High-throughput Sequential Plasma and Thermal ALD Processing Enabling GaN Technologies

Dr. Mikko Söderlund
Head of Sales, Semiconductor ALD, Beneq

Compound Semiconductors - Can Taiwan Help?

Ms. Claire Troadec
Division Director, Power & Wireless, Yole Intelligence

Closing Remarks

郭浩中 Dr. Hao-Chung Kuo
所長,半導體研究所,鴻海研究院
Director of Semiconductor Research Center, Hon Hai Research Institute (Foxconn)

Adjournment